Antenna in Package Arrangement
In an embodiment, a device includes: a first support structure having a main surface and an edge surface; a screen covering the first support structure and having a main surface and an edge surface; a glass covering the screen; a frame; and a package electrically coupled to the first support structu...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | In an embodiment, a device includes: a first support structure having a main surface and an edge surface; a screen covering the first support structure and having a main surface and an edge surface; a glass covering the screen; a frame; and a package electrically coupled to the first support structure via a connector, the package including a radio-frequency integrated circuit (RFIC) and a laminate that has a plurality of interconnect levels including an end-fire antenna configured to direct a first millimeter-wave radiation beam through the glass, and a patch antenna configured to direct a second millimeter-wave radiation beam through the frame, where the screen partially covers the laminate. |
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