SEMICONDUCTOR DEVICE PACKAGE

A semiconductor device package is disclosed. The semiconductor device package includes a carrier, a first electronic component disposed on the carrier and a support component disposed on the carrier. The semiconductor device package also includes a second electronic component disposed on the first e...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIN, Cheng-Nan, LEE, Ming-Chiang, YEH, Yung-I
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A semiconductor device package is disclosed. The semiconductor device package includes a carrier, a first electronic component disposed on the carrier and a support component disposed on the carrier. The semiconductor device package also includes a second electronic component disposed on the first electronic component and supported by the support component.