BGA STIFFENER ATTACHMENT WITH LOW EOLIFE ADHESIVE STRENGTH AT HIGH SOLDER JOINT STRESS AREA GENERATED FROM ENABLING LOAD

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an e...

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Bibliographische Detailangaben
Hauptverfasser:	NARDI, Patrick, RAGHAVAN, Prasanna, GENG, Phil, SAHA, Sanjoy, HARPER, John, XU, Dingying David, MAHAJAN, Ravindranath V, JIAO, Yang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.