PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES

One example of a pre-molded lead frame includes a mold body, a plurality of recesses, a plurality of first leads, and a die pad. The mold body includes a first main surface and a second main surface opposite to the first main surface. Each recess of the plurality of recesses extends from the first m...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LAZALA, Romel Solanoy, WAGIMAN, Mohamad Yazid Bin, REYNOSO, Dexter Inciong, UPENDRA, Balehithlu Manjappaiah
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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