PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES

One example of a pre-molded lead frame includes a mold body, a plurality of recesses, a plurality of first leads, and a die pad. The mold body includes a first main surface and a second main surface opposite to the first main surface. Each recess of the plurality of recesses extends from the first m...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LAZALA, Romel Solanoy, WAGIMAN, Mohamad Yazid Bin, REYNOSO, Dexter Inciong, UPENDRA, Balehithlu Manjappaiah
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	One example of a pre-molded lead frame includes a mold body, a plurality of recesses, a plurality of first leads, and a die pad. The mold body includes a first main surface and a second main surface opposite to the first main surface. Each recess of the plurality of recesses extends from the first main surface into the mold body. The plurality of first leads are coupled to the mold body and extend from a third surface of the mold body. The third surface extends between the first main surface and the second main surface. The die pad is connected to at least one of the plurality of first leads. The die pad includes a first surface aligned with the second main surface of the mold body.