SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD

SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD

A semiconductor package comprises a package substrate comprised of at least a first layer of dielectric material including a portion of diamond dust material. The diamond dust material is comprised of diamond dust particles. The semiconductor package includes at least one electrical connection coupl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hanna, Carlton, Reif, Stefan, Talebbeydokhti, Pouya, Stoeckl, Stephan, Seidemann, Georg, Molzer, Wolfgang
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package comprises a package substrate comprised of at least a first layer of dielectric material including a portion of diamond dust material. The diamond dust material is comprised of diamond dust particles. The semiconductor package includes at least one electrical connection coupled through layers of the package substrate.