PIXELATED SHOWERHEAD FOR RF SENSITIVE PROCESSES

Exemplary semiconductor processing chambers may include a gas delivery assembly. The chambers may include a substrate support. The chambers may include a faceplate positioned between the gas delivery assembly and the substrate support. The faceplate may be characterized by a first surface and a second surface. The second surface of the faceplate and the substrate support may at least partially define a processing region. The faceplate may define a first plurality of apertures and a second plurality of apertures. Each of the first plurality of apertures may include a first generally conical aperture profile that extends through the second surface that extends through the second surface. Each of the second plurality of apertures may include a second generally conical aperture profile that extends through the second surface. The second generally conical aperture profile may be different than the first generally conical aperture profile.