PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYERED PRINTED WIRING BOARD

There is provided a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, in which the photopolymerizable compound (A) having an ethylenically unsaturated group conta...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAKAMURA, Akihiro, OTSUKA, Kohei, SAKAMOTO, Norihiko, SAWAMOTO, Hayato
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:There is provided a photosensitive resin composition that contains (A) a photopolymerizable compound having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, in which the photopolymerizable compound (A) having an ethylenically unsaturated group contains (A1) a photopolymerizable compound having an acidic substituent and an alicyclic structure together with an ethylenically unsaturated group. There is provided a photosensitive resin film and a photosensitive resin film for interlayer insulating layer, each of which contains the photosensitive resin composition. There is provided a multilayer printed wiring board and a semiconductor package. There is further provided a method for producing the multilayer printed wiring board.