METHOD FOR PACKING AND UNPACKING FLAT SUBSTRATES
A method for packing flat substrates, more particularly glass substrates, in a packaging box is provided. The method include the steps of: providing a base part of the packaging box, the base part comprising a lower wall and preferably four side walls, placing a flat substrate directly or indirectly...
Gespeichert in:
Hauptverfasser: | , , , , , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A method for packing flat substrates, more particularly glass substrates, in a packaging box is provided. The method include the steps of: providing a base part of the packaging box, the base part comprising a lower wall and preferably four side walls, placing a flat substrate directly or indirectly on the lower wall of the base part of the packaging box, placing an intermediate layer directly or indirectly on the placed flat substrate, forming a stack of flat substrates and intermediate layers therebetween by repeating the preceding two steps, and setting a cover part of the packaging box on the base part of the packaging box. |
---|