METHOD FOR PACKING AND UNPACKING FLAT SUBSTRATES

A method for packing flat substrates, more particularly glass substrates, in a packaging box is provided. The method include the steps of: providing a base part of the packaging box, the base part comprising a lower wall and preferably four side walls, placing a flat substrate directly or indirectly...

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Bibliographische Detailangaben
Hauptverfasser: Gäckle, Lutz, Buchhorn, Rainer, Maedje, Michael, Kania, Michael, Kurek, Klaus-Peter, Glacki, Alexander, Weems, Anke, Düsing, Ernst-Friedrich, Brunotte, Andreas
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method for packing flat substrates, more particularly glass substrates, in a packaging box is provided. The method include the steps of: providing a base part of the packaging box, the base part comprising a lower wall and preferably four side walls, placing a flat substrate directly or indirectly on the lower wall of the base part of the packaging box, placing an intermediate layer directly or indirectly on the placed flat substrate, forming a stack of flat substrates and intermediate layers therebetween by repeating the preceding two steps, and setting a cover part of the packaging box on the base part of the packaging box.