FLUX AND SOLDER PASTE

A flux containing 1 to 10 wt % of an organic sulfonic acid activator, 10 to 40 wt % of a high-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of more than 1200 and 5 to 75 wt % of a low-molecular-weight nonionic surfactant that is a nonion...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMADA, Yo, SUGII, Hiroshi, KAJIKAWA, Yasuhiro
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A flux containing 1 to 10 wt % of an organic sulfonic acid activator, 10 to 40 wt % of a high-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of more than 1200 and 5 to 75 wt % of a low-molecular-weight nonionic surfactant that is a nonionic surfactant having a mass-average molecular weight Mw of 1200 or less, in which the content of the low-molecular-weight nonionic surfactant is equal to or larger than the content of the organic sulfonic acid activator. This flux contains no cationic surfactant or contains more than 0 wt % and 5 wt % or less of the cationic surfactant. A solder paste containing this flux and a Sn-based solder metal.