MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a substrate, including a core and a stiffener in the core, wherein the stiffener is along a perimeter of the core; and a die electrically coupled t...

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Bibliographische Detailangaben
Hauptverfasser: Hanna, Carlton, Gowda, Mohan Prashanth Javare, Bacha, Abdallah, Waidhas, Bernd, De Mesa, Eduardo
Format: Patent
Sprache:eng
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Zusammenfassung:Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a substrate, including a core and a stiffener in the core, wherein the stiffener is along a perimeter of the core; and a die electrically coupled to the substrate.