MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS

Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a substrate having a first surface and an opposing second surface; a die electrically coupled to the second surface of the substrate; and a stiffen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Hanna, Carlton, Gowda, Mohan Prashanth Javare, Bacha, Abdallah, Waidhas, Bernd, De Mesa, Eduardo
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. In some embodiments, a microelectronic assembly may include a substrate having a first surface and an opposing second surface; a die electrically coupled to the second surface of the substrate; and a stiffener attached to the first surface of the substrate configured to mitigate warpage of the die.