WIRING STRUCTURE, SEMICONDUCTOR MODULE, AND VEHICLE

A conductive member constituting a wiring structure includes a first bonding section bonded to an electronic component, a second bonding section bonded to a connection target for the electronic component, and a raised section that protrudes upward from the first bonding section and is connected to t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: NAKATA, Hitoshi, KANAI, Naoyuki, HINATA, Yuichiro
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A conductive member constituting a wiring structure includes a first bonding section bonded to an electronic component, a second bonding section bonded to a connection target for the electronic component, and a raised section that protrudes upward from the first bonding section and is connected to the second bonding section. The conductive member has a wire member passage through which a wire member passes, and which is provided in at least a part of the raised section. The wire member passage enables the wire member to be disposed along the raised section from the first bonding section to the second bonding section such that the wire member intersects a surface of the raised section.