RESIN COMPOSITION FOR FLEXIBLE DEVICE, FILM-LIKE ADHESIVE FOR FLEXIBLE DEVICE, ADHESIVE SHEET FOR FLEXIBLE DEVICE, AND METHOD OF PRODUCING FLEXIBLE DEVICE

A resin composition for a flexible device, containing an epoxy resin and a phenoxy resin, wherein a cured product of the resin composition has a glass transition temperature of 60° C. or higher, and the cured product has a storage modulus of 5.0 GPa or less,a film-like adhesive using the resin compo...

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Bibliographische Detailangaben
1. Verfasser:	SAKAI, Koyuki
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	A resin composition for a flexible device, containing an epoxy resin and a phenoxy resin, wherein a cured product of the resin composition has a glass transition temperature of 60° C. or higher, and the cured product has a storage modulus of 5.0 GPa or less,a film-like adhesive using the resin composition,an adhesive sheet having a laminated structure of the film-like adhesive anda flexible base material, and a method of producing a flexible device.