Integrated Strain Relief in Nanoscale Dolan Bridges

Josephson junctions are the main circuit element of superconducting quantum information devices due to their nonlinear inductance properties and fabrication scalability. However, large scale integration necessarily depends on high fidelity and high yielding fabrication of Josephson junctions. The standard Josephson junction technique depends on a submicron suspended resist Dolan bridge that tends to be very fragile and fractures during the fabrication process. The present invention is directed to a new tunnel junction resist mask that incorporates stress-relief channels to reduce the intrinsic stress of the resist, thereby increasing the survivability of the Dolan bridge during device processing, resulting in higher Josephson junction yield.