SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

According to one embodiment, a semiconductor device includes a substrate, a first film including electrode layers and insulating layers alternately stacked on the substrate, and a plurality of insulating films in the first film. The insulating films extend in a first direction parallel to a surface...

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Bibliographische Detailangaben
Hauptverfasser: FURUKAWA, Shinichi, Kashiwada, Saori, Ichikawa, Takashi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:According to one embodiment, a semiconductor device includes a substrate, a first film including electrode layers and insulating layers alternately stacked on the substrate, and a plurality of insulating films in the first film. The insulating films extend in a first direction parallel to a surface of the substrate and spaced from one another in a second direction parallel to the surface of the substrate. The semiconductor device further includes a semiconductor layer provided in at least one of the insulating films and first and second charge accumulation units between the semiconductor layer and one of the electrode layers. The insulating films include a first insulating film having a first width in the second direction and a second insulating film having a second width in the second direction that is greater than the first width.