SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

A semiconductor device includes a substrate, a first chip, a second chip, a first connector, and a second connector. The substrate has a second thickness. The first chip includes a first surface facing the substrate, a second surface positioned at a side opposite to the first surface, a first electr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: OHGURO, Tatsuya
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device includes a substrate, a first chip, a second chip, a first connector, and a second connector. The substrate has a second thickness. The first chip includes a first surface facing the substrate, a second surface positioned at a side opposite to the first surface, a first electrode located at the first surface and electrically connected to the substrate, and a second electrode located at the second surface. The second connector includes a first part positioned above the second chip. A difference between the second thickness and a first thickness of the first part is not more than 20% of the greater of the first thickness or the second thickness.