HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS

The total sum of wiring lengths between reception filters and low-noise amplifiers is reduced. A high frequency module includes a mounting board, a plurality of inductors, a plurality of reception filters, and an IC component. The plurality of inductors are mounted on a first main surface of the mounting board. The plurality of reception filters are mounted on the first main surface of the mounting board. The IC component is mounted on a second main surface of the mounting board and includes a low-noise amplifier. A rectangular region in which the plurality of inductors are positioned overlaps with the IC component when viewed in plan from a thickness direction of the mounting board. An electronic component that is closest to each of three or more sides out of four sides of the rectangular region is at least one of the plurality of reception filters.