ENCAPSULATION ARRANGEMENTS IN LIGHT-EMITTING DIODE PACKAGES

Light-emitting diode (LED) packages and more particularly encapsulation arrangements in LED packages that provide reduced internal stresses are disclosed. LED packages may include housings that form a recess with one or more LED chips provided within the recess. Encapsulation arrangements include multiple encapsulation layers where a first encapsulation layer covers portions of a recess floor and sidewalls of the one or more LED chips, and a second encapsulation layer that covers the first encapsulation layer. In this manner, the first encapsulation layer is configured to buffer internal encapsulation stresses during operation that could lead to delamination of the LED chips.