OPTICAL DEVICE PACKAGE

OPTICAL DEVICE PACKAGE

An optical device package includes a glass substrate, a warpage reducing film, a redistribution layer, and a semiconductor element. The warpage reducing film is disposed directly or indirectly on the glass substrate. The redistribution layer includes a wiring sublayer and an insulating sublayer. The...

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Hauptverfasser: SAIGOU, Shingo, FUJITA, Akira, NAKANISHI, Futoshi, SEKO, Nobuya
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator SAIGOU, Shingo
FUJITA, Akira
NAKANISHI, Futoshi
SEKO, Nobuya
description An optical device package includes a glass substrate, a warpage reducing film, a redistribution layer, and a semiconductor element. The warpage reducing film is disposed directly or indirectly on the glass substrate. The redistribution layer includes a wiring sublayer and an insulating sublayer. The wiring sublayer and the insulating sublayer are at least partially disposed on the warpage reducing film. The semiconductor element is mounted on the redistribution layer.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2023282659A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2023282659A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2023282659A13</originalsourceid><addsrcrecordid>eNrjZBDzDwjxdHb0UXBxDfN0dlUIcHT2dnR35WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGxkYWRmamlo6GxsSpAgAcZx_n</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>OPTICAL DEVICE PACKAGE</title><source>esp@cenet</source><creator>SAIGOU, Shingo ; FUJITA, Akira ; NAKANISHI, Futoshi ; SEKO, Nobuya</creator><creatorcontrib>SAIGOU, Shingo ; FUJITA, Akira ; NAKANISHI, Futoshi ; SEKO, Nobuya</creatorcontrib><description>An optical device package includes a glass substrate, a warpage reducing film, a redistribution layer, and a semiconductor element. The warpage reducing film is disposed directly or indirectly on the glass substrate. The redistribution layer includes a wiring sublayer and an insulating sublayer. The wiring sublayer and the insulating sublayer are at least partially disposed on the warpage reducing film. The semiconductor element is mounted on the redistribution layer.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230907&amp;DB=EPODOC&amp;CC=US&amp;NR=2023282659A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25551,76302</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230907&amp;DB=EPODOC&amp;CC=US&amp;NR=2023282659A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAIGOU, Shingo</creatorcontrib><creatorcontrib>FUJITA, Akira</creatorcontrib><creatorcontrib>NAKANISHI, Futoshi</creatorcontrib><creatorcontrib>SEKO, Nobuya</creatorcontrib><title>OPTICAL DEVICE PACKAGE</title><description>An optical device package includes a glass substrate, a warpage reducing film, a redistribution layer, and a semiconductor element. The warpage reducing film is disposed directly or indirectly on the glass substrate. The redistribution layer includes a wiring sublayer and an insulating sublayer. The wiring sublayer and the insulating sublayer are at least partially disposed on the warpage reducing film. The semiconductor element is mounted on the redistribution layer.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDzDwjxdHb0UXBxDfN0dlUIcHT2dnR35WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGxkYWRmamlo6GxsSpAgAcZx_n</recordid><startdate>20230907</startdate><enddate>20230907</enddate><creator>SAIGOU, Shingo</creator><creator>FUJITA, Akira</creator><creator>NAKANISHI, Futoshi</creator><creator>SEKO, Nobuya</creator><scope>EVB</scope></search><sort><creationdate>20230907</creationdate><title>OPTICAL DEVICE PACKAGE</title><author>SAIGOU, Shingo ; FUJITA, Akira ; NAKANISHI, Futoshi ; SEKO, Nobuya</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2023282659A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>SAIGOU, Shingo</creatorcontrib><creatorcontrib>FUJITA, Akira</creatorcontrib><creatorcontrib>NAKANISHI, Futoshi</creatorcontrib><creatorcontrib>SEKO, Nobuya</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAIGOU, Shingo</au><au>FUJITA, Akira</au><au>NAKANISHI, Futoshi</au><au>SEKO, Nobuya</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OPTICAL DEVICE PACKAGE</title><date>2023-09-07</date><risdate>2023</risdate><abstract>An optical device package includes a glass substrate, a warpage reducing film, a redistribution layer, and a semiconductor element. The warpage reducing film is disposed directly or indirectly on the glass substrate. The redistribution layer includes a wiring sublayer and an insulating sublayer. The wiring sublayer and the insulating sublayer are at least partially disposed on the warpage reducing film. The semiconductor element is mounted on the redistribution layer.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title OPTICAL DEVICE PACKAGE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T03%3A25%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAIGOU,%20Shingo&rft.date=2023-09-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2023282659A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true