OPTICAL DEVICE PACKAGE

OPTICAL DEVICE PACKAGE

An optical device package includes a glass substrate, a warpage reducing film, a redistribution layer, and a semiconductor element. The warpage reducing film is disposed directly or indirectly on the glass substrate. The redistribution layer includes a wiring sublayer and an insulating sublayer. The...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SAIGOU, Shingo, FUJITA, Akira, NAKANISHI, Futoshi, SEKO, Nobuya
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An optical device package includes a glass substrate, a warpage reducing film, a redistribution layer, and a semiconductor element. The warpage reducing film is disposed directly or indirectly on the glass substrate. The redistribution layer includes a wiring sublayer and an insulating sublayer. The wiring sublayer and the insulating sublayer are at least partially disposed on the warpage reducing film. The semiconductor element is mounted on the redistribution layer.