LATERAL SEMICONDUCTOR DEVICE COMPRISING UNIT CELLS WITH HEXAGON CONTOURS

A semiconductor device includes a die layer comprising a main surface. A plurality of first terminals are mounted on the main surface of the die layer, the first terminals forming a grid of unit cells with hexagon contours arranged side-by-side across the main surface of the die layer. A plurality of second terminals are mounted on the main surface of the die layer, each second terminal forming a hexagon contour arranged within a unit cell of a respective first terminal. A plurality of third terminals is mounted on the main surface of the die layer, each third terminal formed as a hexagon and arranged within the hexagon contour of a respective second terminal. At least two metallization layers are arranged over the plurality of first, second and third terminals and are configured to receive electrical currents from the plurality of first, second and third terminals.