SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME

Disclosed are substrate processing apparatuses and methods. The substrate processing apparatus comprises a chuck that supports a substrate, an insulator ring that surrounds the chuck, a focus ring on the insulator ring, and a ground ring outside the insulator ring. The ground ring includes a ground ring body and an extension ring on the ground ring body. A width of the extension ring is less than that of the ground ring body. An inner lateral surface of the extension ring is more outwardly than that of the ground ring body. A difference in level between a top of the extension ring and a top surface of the chuck is in a range of about 52 mm to about 60 mm.