NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING

NOTCHED WAFER AND BONDING SUPPORT STRUCTURE TO IMPROVE WAFER STACKING

Various embodiments of the present disclosure are directed towards a processing tool. The processing tool includes a housing structure defining a chamber. A first plate is disposed in the chamber. A first plasma exclusion zone (PEZ) ring is disposed on the first plate. A second plate is disposed in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Li, Sheng-Chan, Chen, Sheng-Chau, Chou, Cheng-Hsien, Tsai, Cheng-Yuan
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Various embodiments of the present disclosure are directed towards a processing tool. The processing tool includes a housing structure defining a chamber. A first plate is disposed in the chamber. A first plasma exclusion zone (PEZ) ring is disposed on the first plate. A second plate is disposed in the chamber and underlies the first plate. A second PEZ ring is disposed on the second plate. The second PEZ ring comprises a PEZ ring notch that extends inwardly from a circumferential edge of the second PEZ ring.