SEMICONDUCTOR APPARATUS

A semiconductor device includes a semiconductor element, a conductive member and a connecting member. The semiconductor element has a reverse surface formed with a first electrode and an obverse surface formed with a second electrode and a third electrode. The reverse surface and the obverse surface are spaced apart from each other in a z direction. Current flow between the first electrode and the second electrode is on-off controlled according to a first drive signal inputted to the third electrode. The conductive member has a first bond surface and a second bond surface each facing in the same direction as the reverse surface. The third electrode is bonded to the first bond surface. The connecting member is bonded to the second bond surface, and the second bond surface does not overlap with the semiconductor element as viewed in the z direction.