SOLID-STATE IMAGING DEVICE, METHOD OF PRODUCING THE SAME, AND ELECTRONIC APPARATUS

Electrical connection between mutually facing electrodes is provided. A solid-state imaging device includes: a first semiconductor base; a second semiconductor base bonded to the first semiconductor base; and a conductive polymer, the first semiconductor base including a first semiconductor layer in which a photoelectric conversion unit is provided, a first multilayer wiring layer stacked on the first semiconductor layer, and a first metal pad formed on a surface of the first multilayer wiring layer on a side opposite to the first semiconductor layer, the second semiconductor base including a second semiconductor layer in which an active element is provided, a second multilayer wiring layer stacked on the second semiconductor layer, and a second metal pad on a surface of the second multilayer wiring layer on a side opposite to the second semiconductor layer, the conductive polymer electrically connecting the first metal pad and to the second metal pad.