ELECTRONIC PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

An electronic package structure and its manufacturing method are provided. The electronic package structure includes an interposer, a circuit board, a chip, and a circuit structure. The interposer includes an interposer substrate and a coaxial conductive element located in the interposer substrate....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wang, Chin-Sheng, Chen, Jun-Ho, Tain, Ra-Min, Lin, Wen-Yu, Wang, Tse-Wei, Ma, Guang-Hwa
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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