COVER TAPE AND ELECTRONIC COMPONENT PACKAGE

This cover tape has at least a base layer and a heat seal layer, wherein the heat seal layer contains a polystyrene-based resin (A) and an ethylene-(meth)acrylic acid-based copolymer (B), and contents of the component (A) and the component (B) are more than 80 parts by mass and 95 parts by mass or l...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TOKUNAGA, Hisatsugu, ATSUSAKA, Takanori, NAKAJIMA, Gosuke, NABA, Keisuke
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	This cover tape has at least a base layer and a heat seal layer, wherein the heat seal layer contains a polystyrene-based resin (A) and an ethylene-(meth)acrylic acid-based copolymer (B), and contents of the component (A) and the component (B) are more than 80 parts by mass and 95 parts by mass or less and 5 parts by mass or more and less than 20 parts by mass with respect to a total of 100 parts by mass of the component (A) and the component (B).