HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME

HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME

An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component there...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KWON, Moonhyung, HAM, Taewook, PARK, Min, YUN, Younggirl, CHOI, Taekkyun
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:An electronic device according to various embodiments of the present disclosure may comprise: a circuit board; at least one electronic component disposed on one surface of the circuit board; a shield can mounted to the one surface of the circuit board and accommodating the electronic component therein and includes at least one opening formed in the area corresponding to the electric component; a heat-dissipating structure disposed in at least a part of the shield can to close at least a part of the at least one opening; and a heat transfer member disposed between and in contact with the electronic component and the heat-dissipating structure and at least a part of which is disposed in the at least one opening.