METHODS FOR FORMING ELECTRONIC DEVICE HOUSINGS

Housings for electronic devices may include a steel body, such as a stainless steel body, that has an outer portion and an inner portion. The outer portion may exhibit an average Vickers hardness of 200 HV or higher. The inner portion may exhibit an average Vickers hardness of 180 HV or lower. The l...

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Bibliographische Detailangaben
Hauptverfasser:	Santini, Eric, Murphy, Luke, Yao, Zhicong, Liang, Robert
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	Housings for electronic devices may include a steel body, such as a stainless steel body, that has an outer portion and an inner portion. The outer portion may exhibit an average Vickers hardness of 200 HV or higher. The inner portion may exhibit an average Vickers hardness of 180 HV or lower. The lower hardness of the inner portion may facilitate working the material of the inner portion, such as to form attachment points, protrusions, holes, or other features. Various additional devices, methods, and systems are also disclosed.