A PROCEDURE TO ENABLE DIE REWORK FOR HYBRID BONDING

Methods of bonding one or more dies to a substrate are provided herein. In some embodiments, a method of bonding one or more dies to a substrate includes: applying a material coating on the one or more dies or the substrate; placing the one or more dies on the substrate so that the one or more dies...

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Bibliographische Detailangaben
Hauptverfasser:	WANG, Ying, SEE, Guan Huei
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Methods of bonding one or more dies to a substrate are provided herein. In some embodiments, a method of bonding one or more dies to a substrate includes: applying a material coating on the one or more dies or the substrate; placing the one or more dies on the substrate so that the one or more dies temporarily adhere to the substrate via surface tension or tackiness of the material coating; inspecting each of the one or more dies that are placed on the substrate for defects; and removing any of the one or more dies that are found to have defects.