GATE ALL AROUND BACKSIDE POWER RAIL WITH DIFFUSION BREAK
Semiconductor devices and methods of manufacturing the same are described. The method includes forming a diffusion break opening on the backside and filling with a diffusion break material to serve as a planarization stop. In some embodiments, a single diffusion break opening is formed. In other emb...
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Zusammenfassung: | Semiconductor devices and methods of manufacturing the same are described. The method includes forming a diffusion break opening on the backside and filling with a diffusion break material to serve as a planarization stop. In some embodiments, a single diffusion break opening is formed. In other embodiments, a mixed diffusion break opening is formed. |
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