GATE ALL AROUND BACKSIDE POWER RAIL WITH DIFFUSION BREAK

Semiconductor devices and methods of manufacturing the same are described. The method includes forming a diffusion break opening on the backside and filling with a diffusion break material to serve as a planarization stop. In some embodiments, a single diffusion break opening is formed. In other emb...

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Bibliographische Detailangaben
Hauptverfasser: Yeoh, Andrew, Pranatharthiharan, Balasubramanian, Bazizi, El Mehdi, Pal, Ashish, Colombeau, Benjamin
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Semiconductor devices and methods of manufacturing the same are described. The method includes forming a diffusion break opening on the backside and filling with a diffusion break material to serve as a planarization stop. In some embodiments, a single diffusion break opening is formed. In other embodiments, a mixed diffusion break opening is formed.