ELECTRICAL PACKAGES WITH NON-LINEAR INTERCONNECT MEMBERS

An electrical package can include a substrate having a first side and a second side opposite the first side. One or more electrical components mounted to the substrate, and a plurality of electrically conductive interconnect members can be coupled to the second side of the substrate. At least one of...

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Bibliographische Detailangaben
Hauptverfasser: Chen, Howard E, Sailer, Jeffrey
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An electrical package can include a substrate having a first side and a second side opposite the first side. One or more electrical components mounted to the substrate, and a plurality of electrically conductive interconnect members can be coupled to the second side of the substrate. At least one of the interconnect members can be L-shaped. The L-shaped interconnect member with can be positioned at or proximate one of the corners. The interconnect members can be arranged as a two-dimensional array, with first interconnect members each occupying a single array location, and second interconnect members each occupying at least three array locations that are arranged nonlinearly. The package can be a dual-sided molded package.