INTEGRATED THERMAL SOLUTION TO ENABLE OPERATION OF EMBEDDED PROCESSORS IN SUB-ZERO TEMPERATURES

Integrated circuit dies, systems, devices, and techniques, are described herein related to embedding a thermal solution into an integrated circuit die to heat the integrated circuit die when deployed in sub-zero environments, techniques for operating the thermal solution in a system, and techniques...

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Bibliographische Detailangaben
Hauptverfasser:	Connolly, Kevin, Rawal, Chetan, Kondapuram, Ganesh
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING CONTROLLING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS REGULATING SEMICONDUCTOR DEVICES SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
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Beschreibung
Zusammenfassung:	Integrated circuit dies, systems, devices, and techniques, are described herein related to embedding a thermal solution into an integrated circuit die to heat the integrated circuit die when deployed in sub-zero environments, techniques for operating the thermal solution in a system, and techniques for fabricating the embedded thermal solution. The thermal solution includes a resistive heating element having the same material and substantially coplanar with components of devices of the integrated circuit die.