HIGH PURITY SULFUR-DOPED COPPER SPUTTERING TARGET ASSEMBLY AND METHOD FOR PRODUCING SAME

Provided are copper and copper alloy sputtering targets and sputtering target assemblies, including copper-sulfur sputtering targets, and systems and methods thereof. The copper and copper alloy sputtering targets, including copper-sulfur sputtering targets may have one or more (or all) of the follo...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Del-Rio Perez, Eduardo, Whitt, Harrison Collin
Format: Patent
Sprache:eng
Schlagworte:
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