HIGH PURITY SULFUR-DOPED COPPER SPUTTERING TARGET ASSEMBLY AND METHOD FOR PRODUCING SAME

Provided are copper and copper alloy sputtering targets and sputtering target assemblies, including copper-sulfur sputtering targets, and systems and methods thereof. The copper and copper alloy sputtering targets, including copper-sulfur sputtering targets may have one or more (or all) of the following properties: high purity, uniform composition and distribution, increased or requisite mechanical stability to provide joining mechanisms, and the like. In an embodiment, the sulfur-doped copper alloy compositions and sputtering targets may have a purity of 99.999 wt % or more and/or a uniform composition of sulfur up to 5 wt %.