WOUND CLOSURE DEVICE FOR WIDE TREATMENT AREAS

A wound closure device includes an elastic substrate and a plurality of microstructure arrays coupled to the elastic substrate via an adhesive layer. The device is long enough or wide enough to treat large wounds with the plurality of microstructure arrays distributed along a length of the wound.

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Bibliographische Detailangaben
Hauptverfasser: Berenson, Ronald J, Leung, Cheuk Yin Paul
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A wound closure device includes an elastic substrate and a plurality of microstructure arrays coupled to the elastic substrate via an adhesive layer. The device is long enough or wide enough to treat large wounds with the plurality of microstructure arrays distributed along a length of the wound.