POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHODS FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHODS FOR PRODUCING A SEMICONDUCTOR ARRANGEMENT

A power semiconductor module arrangement includes a housing, a substrate arranged inside the housing, a printed circuit board arranged inside the housing distant from and in parallel to the substrate, an encapsulant at least partly filling the interior of the housing and covering the substrate and t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Bönig, Guido, Lassmann, Matthias, Arens, Andre, Ludwig, Marco
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A power semiconductor module arrangement includes a housing, a substrate arranged inside the housing, a printed circuit board arranged inside the housing distant from and in parallel to the substrate, an encapsulant at least partly filling the interior of the housing and covering the substrate and the printed circuit board, and a heat protective layer arranged inside the housing between the substrate and the printed circuit board, and extending in a plane that is parallel to the substrate and the printed circuit board. A thermal resistance of the heat protective layer is greater than a thermal resistance of the encapsulant.