TOUCH SENSING INTEGRATED CIRCUIT SYSTEM, TOUCH SENSING SYSTEM, AND METHOD FOR WRITING FIRMWARE

An embodiment is able to simplify the design and manufacturing process by unifying the step of writing boot loaders to the integrated circuits.

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: LEE, Gyu Chul
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:An embodiment is able to simplify the design and manufacturing process by unifying the step of writing boot loaders to the integrated circuits.