WATER-BASED BINDER SOLUTIONS FOR USE IN ADDITIVE MANUFACTURING PROCESSES

In various embodiments, a water-based binder solution for use in additive manufacturing, includes a thermoplastic binder. The thermoplastic binder includes a first polymer strand having a weight average molecular weight (Mw) of from greater than or equal to 5,000 g/mol to less than or equal to 15,00...

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Bibliographische Detailangaben
Hauptverfasser:	Alberts, William C, Bromberg, Vadim, Natarajan, Arunkumar
Format:	Patent
Sprache:	eng
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASTING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POWDER METALLURGY SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING METALLIC POWDER WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	In various embodiments, a water-based binder solution for use in additive manufacturing, includes a thermoplastic binder. The thermoplastic binder includes a first polymer strand having a weight average molecular weight (Mw) of from greater than or equal to 5,000 g/mol to less than or equal to 15,000 g/mol, a second polymer strand having a weight average molecular weight of from greater than or equal to 10,000 g/mol to less than or equal to 50,000 g/mol, and a third polymer strand having a weight average molecular weight of from greater than or equal to 1,000 g/mol to less than or equal to 5,000 g/mol. The binder solution further comprises from greater than or equal to 0.1 wt% to less than or equal to 5 wt% of a non-aqueous solvent having a boiling point of greater than 100° C.