SEMICONDUCTOR DEVICE

The present invention provides a semiconductor device, the semiconductor device includes a metal interconnection on a substrate, in which a top view of the metal interconnection comprises a quadrilateral; and a magnetic tunneling junction (MTJ) on the metal interconnection, in which a top view of th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Chang, I-Fan, Wang, Yu-Ping, Wu, Jia-Rong, Tsai, Ya-Huei, Huang, Rai-Min
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention provides a semiconductor device, the semiconductor device includes a metal interconnection on a substrate, in which a top view of the metal interconnection comprises a quadrilateral; and a magnetic tunneling junction (MTJ) on the metal interconnection, in which a top view of the MTJ comprises a circular shape.