Curable Composition and Two-Component Curable Composition

The present application can provide a curable composition comprising an alkenyl group-containing polyorganosiloxane component; a silicon-bonded hydrogen-containing polyorganosiloxane component; and a filler component having a filler having a hydroxyl group on the surface, which has excellent storage...

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Bibliographische Detailangaben
Hauptverfasser:	Kim, Tae Hee, Jeong, Han Nah, Son, Ho Yeon, Jun, Shin Hee, Lee, Ha Na, Kang, Yang Gu
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present application can provide a curable composition comprising an alkenyl group-containing polyorganosiloxane component; a silicon-bonded hydrogen-containing polyorganosiloxane component; and a filler component having a filler having a hydroxyl group on the surface, which has excellent storage stability due to no change in physical properties such as viscosity or hardness during storage, and a two-component curable composition comprising such a curable composition. In addition, the present application can provide a curable composition having excellent storage stability without using a separate additive or without any surface treatment process of a thermally conductive filler, and a two-component curable composition comprising such a curable composition.