ELECTROFILL FROM ALKALINE ELECTROPLATING SOLUTIONS

Disclosed are alkaline electrodeposition solutions and apparatus and methods for using such solutions to electroplate metal. During electroplating, the solutions may produce superconformal fill of metal in features such as features having a critical dimension of about 20 nm or less. The metal electr...

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Bibliographische Detailangaben

Hauptverfasser:	Reid, Jonathan David, Liu, Yi Hua, Huie, Matthew Martin, Brogan, Lee J
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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