COMPOUND, CMP SLURRY COMPOSITION INCLUDING THE SAME AND POLISHING METHOD USING THE SAME

COMPOUND, CMP SLURRY COMPOSITION INCLUDING THE SAME AND POLISHING METHOD USING THE SAME

A compound or a salt thereof, a CMP slurry composition including the same, and a polishing method using the same, the compound being represented by Formula 1,

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Bibliographische Detailangaben
Hauptverfasser: CHOI, Se Young, KIM, Yong Goog, HWANG, Ja Young, KIM, Jeong Hee, SIM, Soo Yeon, CHO, Youn Jin
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVES
CHEMISTRY
DYES
HETEROCYCLIC COMPOUNDS
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
ORGANIC CHEMISTRY
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SKI WAXES
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Beschreibung
Zusammenfassung:A compound or a salt thereof, a CMP slurry composition including the same, and a polishing method using the same, the compound being represented by Formula 1,