LOW VIA RESISTANCE INTERCONNECT STRUCTURE

An interconnect structure comprising a low via resistance via structure is disclosed. The via structure comprises a barrier layer on sidewalls and at bottom of the via structure. The interconnect structure also includes a first metal layer. The interconnect structure further includes a second metal...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Zhu, John Jianhong, Nallapati, Giridhar, BAO, Junjing
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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