LOW VIA RESISTANCE INTERCONNECT STRUCTURE

An interconnect structure comprising a low via resistance via structure is disclosed. The via structure comprises a barrier layer on sidewalls and at bottom of the via structure. The interconnect structure also includes a first metal layer. The interconnect structure further includes a second metal...

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Bibliographische Detailangaben
Hauptverfasser: Zhu, John Jianhong, Nallapati, Giridhar, BAO, Junjing
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An interconnect structure comprising a low via resistance via structure is disclosed. The via structure comprises a barrier layer on sidewalls and at bottom of the via structure. The interconnect structure also includes a first metal layer. The interconnect structure further includes a second metal layer between the barrier layer at the bottom of the via structure and the first metal layer, wherein the first metal layer and the second metal layer comprise different materials.