SHIELD ENCLOSURES FOR MEMORY MODULES

In example implementations, an apparatus is provided. The apparatus includes a polymer based enclosure, an absorber, and a connection interface. The polymer based enclosure is shaped to enclose a memory module connected to a memory module connection interface on a printed circuit board. The absorber...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Chou, Ying-Chi, Lin, Yi-Feng, Huang, Chien Fa
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:In example implementations, an apparatus is provided. The apparatus includes a polymer based enclosure, an absorber, and a connection interface. The polymer based enclosure is shaped to enclose a memory module connected to a memory module connection interface on a printed circuit board. The absorber is coated over the polymer based enclosure to block radio frequency signals generated by the memory modules. The connection interface is to connect to the memory module connection interface.