REGENERATING METHOD OF REMOVAL LIQUID AND REGENERATED REMOVAL LIQUID

A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containin...

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Bibliographische Detailangaben
Hauptverfasser: FUKUI, Yu, NISHIE, Kenji, NITTA, Koji, YAMAGUCHI, Yoshihito, YASUDA, Masaharu, KASUYA, Koji, SAKAI, Shoichiro, OHSUKA, Ryuta, TSUCHIKO, Akira
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A regenerating method of a removal liquid including: removing a nickel-chromium-containing layer from a substrate using the removal liquid at a time of manufacturing a printed circuit board by a semi-additive method, the substrate including the nickel-chromium-containing layer and a copper-containing layer; collecting the removal liquid that has been used; and contacting the collected removal liquid in collecting the removal liquid with a chelate resin, wherein the chelate resin includes a functional group represented by a following formula (1):where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms in the hydrocarbon groups are substituted with halogen atoms or not substituted with a halogen atom.