PACKAGING STRUCTURE FOR POWER MODULE, PACKAGING METHOD AND ELECTRIC VEHICLE

The disclosure relates to a packaging structure for a power module, a packaging method and an electric vehicle. The packaging structure includes: a circuit board; at least one power chip, where each power chip is fastened on the circuit board, and each power chip is integrated with a sensor that is capable of detecting a working state of the power chip; and a signal chip, where the signal chip is fastened on the circuit board and separated from the power chip, a compiling program is preset in the signal chip, the signal chip is in a communication connection with each sensor, and the signal chip is configured to be capable of being in a communication connection with a predetermined device, so as to output working state data of each power chip to the predetermined device. By detecting the working state of each power chip, the power chip can be protected precisely in real time. The signal chip serves as a connection medium between the sensor and the predetermined device, to reduce a quantity of pins, thereby avoiding generation of an excessively high parasitic inductance.