THROUGH-SILICON VIA LAYOUT FOR MULTI-DIE INTEGRATED CIRCUITS

THROUGH-SILICON VIA LAYOUT FOR MULTI-DIE INTEGRATED CIRCUITS

Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the...

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Bibliographische Detailangaben
Hauptverfasser: KLEMENT, Christopher, CHANG, Edward, HUANG, Tyrone, WUU, John, SINGH NARANG, Jasmeet, JUNG, Wonjun, SMITH, Alan D
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Integrated circuits and integrated circuit dies include TSVs laid out in symmetrical patterns. Because of the symmetrical arrangement of the TSVs and associated routing patterns, an integrated circuit is able to support operation of multiple similar dies that are placed in different positions in the integrated circuit. This in turn simplifies the design and production of the multiple similar dies, thus reducing development and manufacturing costs for the corresponding integrated circuits.